Centura SiNgenPlus LPCVD

Applied Centura SiNgenPlus LPCVD (Low Pressure Chemical Vapor Deposition) is a single-wafer LPCVD silicon nitride deposition system that overcomes the primary limitations of batch furnaces. With its advanced LPCVD technology, SiNgenPlus delivers low temperature deposition, film stress, RI tuning capability and better particle performance for front end silicon nitride applications. SiNgenPlus advantages of wafer-to-wafer repeatability and single-wafer flexibility satisfy the increasingly difficult demands of advanced applications including etch stop and spacer.

The Applied Centura SiNgenPlus LPCVD features optimized temperature uniformity for applications from 600-800°C, high throughput and film uniformity for wide thickness range (100-1000Å) and its ceramic heater materials eliminate wafer-metal contact.

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