Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing
Applied and Besi Expand Strategic Partnership to Advance Next-Gen Packaging for AI Scaling
アプライド マテリアルズとキオクシア、EPICセンターで次世代メモリ技術の発展に向け提携
Scaling Next-Generation 3D NAND with High-Precision Selective Removal