Applied Materials offers a diverse array of flexible service solutions to increase equipment uptime and factory efficiency, enabling fabs to focus on chip production, while lowering cost per wafer. With a wide range of available service solutions, we are committed to providing you with a cost competitive service option to meet your specific equipment and technology requirements.
APPLIED PERFORMANCE SERVICEA comprehensive service program with advanced service technologies and tool specific performance commitments. Maximize your factory productivity with Applied Performance Service. | APPLIED MANAGED SERVICEAn effective program to reduce unscheduled downtime, Applied Managed Service offers predictable costs and priority support. Optimize cost and tool performance with Applied Managed Service. |
APPLIED Standard SERVICEOur standard service program offers expert response to system downs to perform tool maintenance and ensure against unplanned events. | FACTORY TRANSITION SERVICEWhether you are moving one piece of equipment offline or moving an entire semiconductor fab across the world, how do you ensure the job is done right the first time, on time and on budget? Call our factory transition experts. |
Are you interested in the latest technology to move your fab towards more predictive operations? These capabilities enable our service support teams to predict and prevent failures on Applied Materials equipment; customer support engineers combine traditional support service with advanced technology – software, sensors and control mechanisms. TechEdge service capabilities can take your fab operations to the next level.
Is your goal faster yield ramp? Do you need to improve process performance? Or are you looking to reduce costs? FabVantage consultants bring deep expertise and advanced analytical tools to help solve tough production problems that have the greatest impact on your business. Applied FabVantage consulting can uncover hidden productivity in your fab.
We offer a comprehensive portfolio of ≤200mm Applied Materials equipment and upgrades to address a full spectrum of production needs from technology inflections to productivity enhancements. Our equipment and upgrades extend tool lifetime and support a broad variety of devices which enable the mobility evolution including analog, power, image sensor and MEMS.
AnalogAnalog and Mixed Signal IC's growth is driven by the proliferation of wireless technologies. Higher frequencies and output powers define the technical requirements of this class of devices. | PowerThe demand for power management and switching devices is increasing on the expansion of mobile consumer electronics and the implementation of smart appliances to reduce power consumption. |
MEMSThe expanding use of MEMS devices, including accelerometers, gyroscopes and microphones, is a major contributor to the ongoing transformation of the mobile, automotive and medical device markets. | PackagingTo meet the needs of reduced form-factor electronics and ever-shrinking die footprint, the long discussed vertical integration of IC's has finally moved into production in semiconductor fabrication. |
Run green. Process efficiently.
AGS offers several fab environmental solutions to maximize efficiency, lower costs, reduce environmental impact and meet EPA reporting regulations for greenhouse gas emissions.
iSystem™ ControllerA unique control system that continuously monitors the process tool to differentiate process, clean and idle steps and synchronizes subfab utility usage. | Aeris™-G Plasma AbatementThe industry’s leading zero footprint, point-of-use pre-pump abatement technology for oxide and polysilicon etch applications. |
