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Olympia™

Continued process scaling is driving new levels of device performance. ALD is essential for a growing number of the device-critical process steps in 3D NAND and logic FinFET fabrication. However, while the conformality and uniform film thickness achieved with ALD is still vital for CD control, additional demands are being made on ALD to deliver a growing range of high-quality, robust films within restrictive thermal budgets of next-generation nodes.

The Applied Olympia™ ALD system for stand-alone deposition of dielectric and metal films solves the significant challenge of obtaining high-quality ALD films at the low deposition temperatures needed to fabricate planar and 3D devices at next-generation nodes, delivering a new class of high-performance ALD.