TSV fabrication involves thinning device wafers and bonding them to temporary carriers made of glass or silicon. As typical bonding...
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The Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of...
BLOk films enable significant reductions in the capacitance of the dielectric film stack, while maintaining excellent etch selectivity...
The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low...
With more than 3,000 systems shipped worldwide, the Applied Producer is the industry’s most cost-effective wafer processing...
Used in conjunction with Applied Materials' APF™ (Advanced Patterning Film) strippable CVD hardmask, the APF/DARC film stack...
The eHARP film improves upon the first-generation HARP film gap-fill capability by introducing water vapor to the TEOS/ozone chemistry...
While offering the highest throughput density with the Twin Chambers and a two-FOUP, dual robot factory interface, Producer Etch...
Chip manufacturers are continuously designing chips with smaller and smaller transistors to gain more functionality per square...
For customers diversifying to TSV processing, the InVia system offers not only a benchmark process but demonstrated integration...
Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of...
In integrated circuits, current-carrying copper wiring is insulated by dielectric (non-conducting) materials. As semiconductor devices...
The Optiva system deposits a highly conformal, polymer-compatible oxide that can serve as a protective layer on top of the micro-...
The Producer® Selectra™ Etch system introduces unprecedented capabilities for sustaining the momentum of Moore’s Law through further...
The Precision chamber’s specialized design enables uniform layer-to-layer deposition with the film quality required for the gate...
As design rules scale into the single-digit nodes and device architectures become progressively denser and more complex, fabrication...
The RAIDER ECD system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition delivers high throughput...
The Raider GT ECD system for copper interconnect gap fill in memory and logic devices features dynamic current-control technology,...
The Raider M is an automated, high-performance single-wafer ECD system. It features a precision, fully automated wafer handling system...
The Raider M-Quattro is a high-performance single-wafer ECD system featuring fully automated precision wafer handling and multiple...
The Raider-S is a high-volume single-wafer electroplating tool for TSV and wafer-level packaging applications. It features a fully...
Applied SmartFactory Rapid Response Inline Measurement is an integral part of the Applied Materials knowledge management initiative. Its...
The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually...
Featuring six polishing stations and eight integrated cleaning stations with advanced process controls, the system delivers the...
