Enflexor™ TFE System
Plasma Enhanced Chemical Vapor Deposition System for Thin Film Encapsulation
Plasma enhanced chemical vapor deposition – thin film encapsulation (PECVD-TFE) system the Enflexor™ Gen 6H PECVD deposits superior barrier films to enable flexible organic light-emitting diode (OLED) panel technology. The Enflexor Gen6H provides a range of buffer films and mask technology with auto mask exchange for all-in-one system process capability. Yield performance provides a quick path to mass production. The system easily integrates to other OLED tools.