Applied Baccini® LTCC - Low Temperature
Co-Fired Ceramic Equipment
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Combining precision alignment and high throughput substrate handling, Applied’s puncher, screen printer and stacker systems enable Low Temperature Co-Fired Ceramics for manufacturing compact and robust multilayer electronic circuits.
The Applied Baccini LTCC puncher for via formation, screen printers for via fill and patterned printing of conductor lines, and a stacker to accurately collate multiple layers compromise a complete solution for LTCC packaging.
| Applied Baccini LTCC Punching System | Applied Baccini LTCC Screen Print Line | Applied Baccini LTCC Stacker |
| Punch vias and alignment holes at rates of up to 30 holes per second and with +/- 5 micron precision. The puncher is fully automated with a vision alignment system and a camera for post-punching inspection and automatic calibration. The system is also available in custom pin configurations. | A high-productivity screen print and hot-air drying system, combining reliable frameless substrate handling with multi-camera alignment technology for precise printing. | Designed for high productivity with <10s cycle times, inline foil removal, and accuracy to within +/- 5 microns using four high resolution cameras. |
For more information, contact ltcc@amat.com
