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Tackling Key HBM and Advanced Packaging Bottlenecks for the AI Era

Tackling Key HBM and Advanced Packaging Bottlenecks for the AI Era

Jinho An, Ph. D. and Kyla Zhao • August 18, 2026

Applied Materials Announces Third Quarter 2026 Results

Applied Materials Announces Third Quarter 2026 Results

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Press Release • August 13, 2026

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UC Berkeley to Join Applied Materials’ EPIC Center to Speed Chip Innovation 

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Advancing DRAM Performance With Logic-Class Technologies

Advancing DRAM Performance With Logic-Class Technologies

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How Applied Materials is Advancing Sustainability

How Applied Materials is Advancing Sustainability

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Semiconductor Innovation is Key to Energy-Efficient AI

Semiconductor Innovation is Key to Energy-Efficient AI

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Applied Materials to Participate in Upcoming Investor Conferences

Applied Materials to Participate in Upcoming Investor Conferences

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Applied Materials to Report Fiscal Third Quarter 2026 Results on Aug. 13, 2026

Applied Materials to Report Fiscal Third Quarter 2026 Results on Aug. 13, 2026

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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips

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