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Applied Materials Technical Symposium at IITC | Grenoble, France (May 19)

Applied Materials | Event Invitation
 
TECHNICAL SYMPOSIUM
May 19, 2015

Advancing the Frontiers of Interconnect Scaling

Please join us for presentations by

Dan Edelstein, IBM
Chris Wilson, imec
Mehul Naik and Huixiong Dai, Applied Materials

followed by open discussion on innovations for scaling interconnect beyond 10nm. Patterning and metallization breakthroughs may help extend the damascene approach, but the single-digit nodes are bound to test our ingenuity in many new ways.

Register Now
 
 
PROGRAM DETAILS

May 19, 2015
16:45–18:00IITC Poster Session & Applied Materials Co-Sponsored Reception
18:15–19:30Technical Symposium

Maison Minatec Grenoble
3 parvis Louis Neel Cedex 9
Grenoble 38054 F, France
Amphitheater Room

For questions contact your sales representative or email Patricia_E_Seto@amat.com