May 19, 2015
Advancing the Frontiers of Interconnect Scaling
Please join us for presentations by
Dan Edelstein, IBM
Chris Wilson, imec
Mehul Naik and Huixiong Dai, Applied Materials
followed by open discussion on innovations for scaling interconnect beyond 10nm. Patterning and metallization breakthroughs may help extend the damascene approach, but the single-digit nodes are bound to test our ingenuity in many new ways.