2013 Applied Materials Panel Discussion - Washington DC

 
Applied Materials | Event Invitation
 
 
 
TECHNICAL SYMPOSIUM
December 10, 2013
 

3D NAND IS A REALITY
WHAT'S NEXT?
 
 

Join Applied Materials and guest panelists from several industry leaders at the Omni Shoreham Hotel, Washington, D.C. for a thought-provoking examination of the growing momentum in 3D NAND from the device, system, and user perspectives.

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3D NAND is clearly here to stay, with leading-edge memory chipmakers focusing significant resources on this segment. 3D NAND promises substantial benefits in easing key planar scaling limitations, but how far can it be scaled? What issues affect its scaling? Which applications will use it first? Will 3D NAND continue lowering the cost per bit? What technologies will follow?

Hear answers to these questions and more from our distinguished speakers.

Applied Materials looks forward to welcoming you.

 
 
PROGRAM DETAILS
Omni Shoreham Hotel
2500 Calvert Street NW
Washington, D.C.

December 10, 2013
 
5:00 –6:00 PM 
Shuttle service from Hilton Washington Hotel. Shuttles depart from the Terrace Level, T-Street side of the hotel.
 
5:00 – 6:15 PM
Registration and Reception – Robert’s Restaurant.
 
6:15 – 7:30 PM
Panel Discussion – Empire Ballroom.
 
7:30 PM
Return shuttle service to Hilton Washington Hotel.
For questions contact your sales representative or email Patricia_E_Seto@amat.com