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1990-1999 Milestones

  • 1999

    Sales: $4.86B R&D: $681M Patents: 615
    Key Accomplishments
    • First mainstream product to virtually eliminate emissions of global warming PFC (perfluorocompound) gases using remote plasma clean technology, a crossover technology from Display
    • Released FAB300, the first Manufacturing Execution System software designed specifically for 300mm fabs
    • Entered the electrochemical plating (ECP) market with the Electra Cu ECP system, designed for volume manufacturing of high-speed copper based semiconductor chips 
    • CEO James C. Morgan awarded Shanghai’s Magnolia Award for contributions to the Chinese city’s high tech development
    • Opened facility in Rehovot, Israel
    • Opened regional office in Narita, Japan to support FAB300 customers
    • Donated a Precision 5000 system and more than $300,000 to National Tsing Hua University (NTHU) to assist in the construction of a semiconductor manufacturing process research and development facility in Taiwan
    • Donated more than $300,000 to Taiwan Earthquake relief efforts, through the TVBS Caring for Taiwan Foundation
    • Donated two systems, a Centura wafer etching system and an Endura PVD system to the Microsystems Technology Laboratories of the Massachusetts Institute of Technology (MIT) to help students perform research
    • Established graduate fellowship program at the Technion – Israel Institute of Technology
  • 1998

    Sales: $4.04B R&D: $644M Patents: 400
    Key Accomplishments
    • Acquired Consilium, and entered the Manufacturing Execution System software business
    • Opened the Equipment and Process Integration Center (EPIC), the first facility of its kind in the semiconductor industry for customers to develop and test copper interconnect processes
    • Introduced the SEMVision DR-SEM, the first fully automated defect review and classification scanning electron microscope (SEM) designed for in-line operation within advanced production lines
    • Opened Technical Training Center in Singapore
    • Wellness Program named the winner of the prestigious 1998 C. Everett Koop National Health Award; the award recognized programs that improve health and healthy behavior among employees by reducing health risk and medical care costs
  • 1997

    Sales: $4.07B R&D: $568M Patents: 351
    Key Accomplishments
    • First semiconductor equipment maker to ship a 300mm production wafer processing system to a customer
    • Acquired Opal and Orbot Instruments, entering the market for process diagnostics and control equipment
    • Recognized as the 1997 Corporate Food Drive Champion for providing more than 1.7 million pounds of food to Silicon Valley, CA food banks
  • 1996

    Sales: $4.1B R&D: $482M Patents: 445
    Key Accomplishments
    • The National Medal of Technology, America’s highest technology award for technological innovation, presented to Jim Morgan by President Bill Clinton
    • First semiconductor equipment company to open large-scale technology centers in Korea and Taiwan
    • Austin employees (along with Company match) donated over 187,000 pounds of food to the Capital Area Food Bank
  • 1995

    Sales: $3.1B R&D: $330M Patents: 213
    Key Accomplishments
    • Entered the chemical mechanical planarization (CMP) market with the Mirra CMP system, designed for sub-half-micron semiconductor device processing
    • First semiconductor equipment maker to ship more than 1,000 single-wafer, multi-chamber dielectric chemical vapor deposition systems
    • Entered the RTP (rapid thermal processing) market with the RTP Centura, designed to solve critical processing issues, offering potential for yield gains in advanced devices
    • Opened office in Dresden, Germany
    • Austin employees (along with Company match) donated over 285,000 pounds of food to the Capital Area Food Bank
  • 1994

    Sales: $1.6B R&D: $189M Patents: 203
    Key Accomplishments
    • First Lifetime Achievement Award presented to Dan Maydan, Sass Somekh and David N. K. Wang from Semiconductor Equipment and Materials International (SEMI)
    • Austin employees (along with Company match) donated more than $64,000 to non-profit agencies serving Central Texas counties
    • Established Research and Development Fund in Shanghai, China to support local development of science and technology
  • 1993

    Sales: $1B R&D: $140M Patents: 75
    Key Accomplishments
    • First semiconductor equipment manufacturer to exceed $1 billion in annual sales
    • Entered the market for Active-Matrix Liquid Crystal Display (AMLCD) manufacturing equipment with the AKT-1600 PECVD (plasma enhanced chemical vapor deposition), providing enabling technology for the cost effective production of thin film transistors for AMLCDs
    • First semiconductor equipment manufacturer to have its system added to the permanent collection in the Smithsonian Institution
    • Employees donated more than 84,000 pounds of food during, benefiting individuals and families in Santa Clara and San Mateo Counties
  • 1992

    Sales: $751M R&D: $109M Patents: 70
    Key Accomplishments

    Company

    • Became the world's largest semiconductor equipment manufacturer
    • Opened second major site in the United States—in Austin, Texas
    • First U.S. semiconductor equipment maker to form flat panel display equipment venture
    • Opened Technical Training Center in Munich, Germany and Seoul, Korea 
    • Opened offices in Suwon and Chungju, Korea; opened repair shop in Seoul, Korea; and opened sales and service office in Singapore

    Community

    • Launched Charitech, a program designed to introduce high-tech companies to the social service and non-profit communities
    • Received the 1992 Tribute to Women in Industry (TWIN) Award  for expanding opportunities for women in the work place
    • Donated a Precision 5000 wafer-handling robot to University of Texas’ new Robotics Research facility, to facilitate advanced robotics studies
  • 1991

    Sales: $638M R&D: $102M Patents: 44
    Key Accomplishments
    • First semiconductor equipment manufacturer to introduce “paperless” cleanroom documentation using CD ROM technology for technical manuals
    • Announced Edinburgh, Scotland and Swindon,England facilities
    • Opened Technology Center near Tel Aviv, Israel; opened Kansai Parts Center in Osaka, Japan and an office in Fukuoka, Japan
    • Helped fund an educational exhibit at the Austin Children’s Museum entitled “You Are Here: Wondering Through the Solar System”
    • Co-sponsored the American Electronics Association’s “Get Together for Kids” campaign, an initiative to encourage more parental involvement in their children’s schooling
    • Donated $233,000 to the United Way, marking its ninth consecutive year as a “pacesetter” company – the longest streak ever recorded in Santa Clara County
    • First Annual "Spring Food Drive" benefited the Second Harvest Food Bank of Santa Clara and San Mateo counties generated 3,400 pounds of food
  • 1990

    Sales: $567M R&D: $97M Patents: 46
    Key Accomplishments
    • Received the Queen's 25th Anniversary Award for Technological Achievement for the company’s leading role in developing ion implant equipment in Horsham, England
    • First semiconductor equipment maker to offer integrated deposition/etchback for blanket tungsten CVD
    • Formed Applied Materials (Israel) Ltd., opened new Service Center in Hachioji, Japan and opened an office in Taipei, Taiwan
    • Employees pledged $246,882 in donations (along with company match) to the United Way of Santa Clara County in California
    • Donated a Precision 5000 system with chemical vapor deposition and etch chambers to California's Technology Center of Silicon Valley, a high tech educational facility designed to inspire children to learn more about new technologies
    • Donated $25,000 to support the new interactive exhibit and science center, The Garage at the Technology Center of Silicon Valley, in California
    • Donated a two-chamber Precision 5000 Etch system to the Massachusetts Institute of Technology (MIT) for research designed to characterize the effect of resist patterns and surface topography on dry etching processes