• Transistor Inflection: Complexity of High-k Metal Gate

• Wafer-Level Packaging Inflection
• Semitool Testimonial Video

• Opportunities in Mobile Displays: LTPS, OLED and Touch

Technical Briefings

• Applied Raider GT Electrochemical Deposition
  Uniform, small feature fill for copper interconnect fabrication at 22nm and beyond (829KB, PDF)
• Applied Endura Avenir RF PVD NiPt
  Enabling advanced silicides (1.4MB, PDF)
• Applied Centura Conforma
  Breakthrough conformal plasma doping technology for building 3D transistors (1.2MB, PDF)
• Applied DFinder Darkfield Inspection
  First deep UV darkfield tool with best sensitivity to particles-on-pattern (4.5MB, PDF)